Molded body, joining method, and method for producing molded body
A molded body (1A) is provided with: a first portion (10) comprising a first material containing a first thermoplastic resin (A1) and a dielectric filler (B) that generates heat by application of a high-frequency electric field; and a second portion (20) made of a second material different from the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A molded body (1A) is provided with: a first portion (10) comprising a first material containing a first thermoplastic resin (A1) and a dielectric filler (B) that generates heat by application of a high-frequency electric field; and a second portion (20) made of a second material different from the first material of the first portion (10).
一种成型体(1A),具有:第一部分(10),其由包含第一热塑性树脂(A1)以及通过高频电场的施加而发热的介质填料(B)的第一材料构成;第二部分(20),其由与第一部分(10)的第一材料不同的第二材料构成。 |
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