Photosensitive component, camera module and preparation method of photosensitive component

The invention discloses a photosensitive component, a camera module and a preparation method of the photosensitive component, and in the preparation process of the photosensitive component, a photosensitive chip, a circuit board electric connecting piece and an electric connecting wire are packaged into an independent molded photosensitive module through a molding body formed by a molding process. Therefore, when the molded photosensitive module is mounted and electrically connected to the circuit board through a welding process, an area for pressing and an area for cutting do not need to be arranged on the circuit board, and in this way, the photosensitive assembly can have a relatively small size so as to facilitate miniaturization of the camera module. 公开了一种感光组件、摄像模组和感光组件的制备方法，其中，在所述感光组件的制备过程中，将感光芯片、线路板电连接件和电连接线通过模塑工艺所形成的模塑体封装为一个独立的模塑感光模块，这样在所述模塑感光模块通过焊接工艺安装并电连接于线路板时，无需在所述线路板上设置用于压合的区域和用于切割的区域，通过这样的方式，可使得所述感光组件具有相对较小的尺寸以利于摄像模组的小型化。