Electronic device and preparation method thereof

The invention provides an electronic device and a preparation method thereof, and the electronic device comprises a first insulating layer; a first metal bump disposed on the first insulating layer; the second insulating layer is arranged on the first metal bump, the second insulating layer is provided with a first opening, and the first opening exposes part of the first metal bump; wherein the thickness of the first insulating layer is greater than that of the second insulating layer. 本公开是提供一种电子装置及其制备方法，其中该电子装置，包含：第一绝缘层；第一金属凸块，设置于该第一绝缘层上；以及第二绝缘层，设置于该第一金属凸块上，其中，该第二绝缘层具有第一开口，且该第一开口暴露部分该第一金属凸块；其中，该第一绝缘层的厚度大于该第二绝缘层的厚度。