LED core particle transfer method
The invention relates to the technical field of LED chips, in particular to an LED core particle transfer method which comprises the following steps: S2, attaching a magnetic film with the thickness of 0.1-20mm to the surface of a red light core particle; attaching a magnetic film on the surface of...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of LED chips, in particular to an LED core particle transfer method which comprises the following steps: S2, attaching a magnetic film with the thickness of 0.1-20mm to the surface of a red light core particle; attaching a magnetic film on the surface of the green light core particle, wherein the thickness is 20-40mm; attaching a magnetic film on the surface of the blue light core particle, wherein the thickness is 40-60mm; s3, moving the magnetic field group, adsorbing the red light core particles, moving the magnetic field group to the upper part of the substrate, and enabling the red light core particles to fall on the surface of the substrate; s4, enabling the green light core particles to fall on the surface of the substrate; s5, enabling the basket light core particles to fall on the surface of the substrate; the LED core particle transfer method provided by the invention has the beneficial effects that the LED core particle transfer method provided by the in |
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