Apparatus for transferring electronic component from flexible carrier substrate to flexible target substrate and method of transferring electronic component

An apparatus for transferring an electronic component from a flexible carrier substrate to a flexible target substrate is provided. The device comprises a first frame, a second frame, an abutting assembly and a deformation generating mechanism. The first frame is used for bearing the flexible bearing substrate. The second frame is used for bearing a flexible target substrate. The abutting assembly is arranged close to the first frame and controlled by the brake mechanism and can move back and forth in the direction towards and away from the second frame. The deformation generating mechanism is adjacent to the second frame and is arranged opposite to the abutting assembly. When the abutting assembly moves towards the second frame, the deformation generating mechanism can form relative force towards the abutting assembly at the position, relative to the abutting assembly, of the surface of the flexible target substrate borne by the second frame. 本发明提供一种用于将电子组件自挠性承载基板移转至挠性目标基板的装置。装置包括第一框架、第二框架、顶抵组件以及形变产生机构。第一框架用