Bonding system and bonding method

The embodiment of the invention provides a bonding system and a bonding method. The bonding system comprises a bonding assembly, a wafer bearing table, a first alignment assembly, a second alignment assembly and a third alignment assembly, the first alignment assembly and the second alignment assemb...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHANG YUE, LIU TIANJIAN, TIAN YINGCHAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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