Bonding system and bonding method

The embodiment of the invention provides a bonding system and a bonding method. The bonding system comprises a bonding assembly, a wafer bearing table, a first alignment assembly, a second alignment assembly and a third alignment assembly, the first alignment assembly and the second alignment assembly are respectively used for determining a first position parameter of a first alignment mark on the bonding head and a second position parameter of a second alignment mark on a first tube core picked up by the bonding head when the bonding head is located at the first position; the third alignment assembly is used for determining a third position parameter of a third alignment mark on a second tube core on the wafer and determining a fourth position parameter of a first alignment mark on the bonding head when the bonding head is located at the second position; aligning the first tube core and the second tube core according to the first position parameter, the second position parameter, the third position parameter