Silicon wafer retaining ring grinding fluid and preparation method thereof

The invention relates to a silicon wafer retaining ring grinding fluid and a preparation method thereof, the silicon wafer retaining ring grinding fluid comprises the following raw materials by mass percentage: 34-80 wt% of deionized water, 2.3-10 wt% of alumina, 1.5-5 wt% of a dispersant, 16-50 wt%...

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Bibliographische Detailangaben
Hauptverfasser: HUI HONGYE, YAO LIJUN, WAN XUJUN, ZHU HAIQING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a silicon wafer retaining ring grinding fluid and a preparation method thereof, the silicon wafer retaining ring grinding fluid comprises the following raw materials by mass percentage: 34-80 wt% of deionized water, 2.3-10 wt% of alumina, 1.5-5 wt% of a dispersant, 16-50 wt% of silica sol, and 0.2-1 wt% of a bactericide; the total mass percentage content of the raw materials is 100%; and regulating the pH value of the silicon wafer retaining ring grinding fluid to 3.9-4.1 by using a pH regulator. By controlling the ratio and granularity of the grinding material aluminum oxide and the silica sol, the prepared silicon wafer retaining ring grinding fluid can effectively improve the flatness and the surface glossiness of the silicon wafer retaining ring, meanwhile, the phenomenon that the silicon wafer retaining ring grinding fluid is hardened after being placed for a long time is avoided, and the grinding fluid is good in dispersity; in addition, additives such as oxidants are not added,