Wafer grabbing device for overturning front and back surfaces

The invention provides a wafer grabbing device for overturning front and back surfaces, and the device comprises a first clamping jaw assembly which is used for clamping a wafer; the second clamping jaw assembly is used for clamping the wafer, and the wafer clamping directions of the first clamping jaw assembly and the second clamping jaw assembly are opposite; and the overturning driving assembly is connected with the first clamping jaw assembly and the second clamping jaw assembly and used for overturning the first clamping jaw assembly and the second clamping jaw assembly. According to the wafer grabbing device, the upper clamping jaw assembly and the lower clamping jaw assembly can both grab the wafers, the wafers are placed on the corresponding processing stations through the turnover mechanism, and the carrying efficiency is improved. 本发明提供一种用于正反面翻转的晶圆抓取装置，包括：第一卡爪组件，用于对晶圆进行夹持；第二卡爪组件，用于对晶圆进行夹持，第一卡爪组件和第二卡爪组件夹持晶圆的方向相反；翻转驱动组件，连接第一卡爪组件和第二卡爪组件，用于对第一卡爪组件和第二卡爪组件进行翻转。本发明的晶圆抓取装置上下两个卡爪组件都可可以抓取晶圆，通过翻转机构将晶圆放在对应的处理工位