Semiconductor substrate processing apparatus
A semiconductor substrate processing apparatus includes a processing chamber, a wafer boat, and a plurality of wafer supports. The wafer boat is configured to accommodate a plurality of wafers and is receivable in a processing chamber for depositing a layer on each wafer. The wafer boat includes at...
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| creator | OOSTERLAKEN THEODORUS GERARDUS MARIA PIERROT DAVID |
| description | A semiconductor substrate processing apparatus includes a processing chamber, a wafer boat, and a plurality of wafer supports. The wafer boat is configured to accommodate a plurality of wafers and is receivable in a processing chamber for depositing a layer on each wafer. The wafer boat includes at least two wafer boat pillars, wherein each wafer boat pillar includes a plurality of slots. Each wafer support includes a support region configured to support at least a circumferential edge of a wafer, and a flange circumferentially surrounding the support region. The flange may be received in and supported by the slot and have a width that creates a distance between the circumferential edge of the wafer and the wafer boat pillar. The distance is such that the wafer boat pillars do not substantially affect a layer thickness of a layer deposited on the wafer during wafer processing.
一种半导体衬底处理设备，包括处理室、晶片舟和多个晶片支撑件。晶片舟配置为容纳多个晶片，并且可容纳在处理室中，用于在每个晶片上沉积层。晶片舟包括至少两个晶片舟支柱，其中每个晶片舟支柱包括多个狭槽。每个晶片支撑件包括配置为支撑晶片的至少周向边缘的支撑区域，以及周向围绕支撑 |
| format | Patent |
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一种半导体衬底处理设备，包括处理室、晶片舟和多个晶片支撑件。晶片舟配置为容纳多个晶片，并且可容纳在处理室中，用于在每个晶片上沉积层。晶片舟包括至少两个晶片舟支柱，其中每个晶片舟支柱包括多个狭槽。每个晶片支撑件包括配置为支撑晶片的至少周向边缘的支撑区域，以及周向围绕支撑</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230505&DB=EPODOC&CC=CN&NR=116072578A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230505&DB=EPODOC&CC=CN&NR=116072578A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OOSTERLAKEN THEODORUS GERARDUS MARIA</creatorcontrib><creatorcontrib>PIERROT DAVID</creatorcontrib><title>Semiconductor substrate processing apparatus</title><description>A semiconductor substrate processing apparatus includes a processing chamber, a wafer boat, and a plurality of wafer supports. The wafer boat is configured to accommodate a plurality of wafers and is receivable in a processing chamber for depositing a layer on each wafer. The wafer boat includes at least two wafer boat pillars, wherein each wafer boat pillar includes a plurality of slots. Each wafer support includes a support region configured to support at least a circumferential edge of a wafer, and a flange circumferentially surrounding the support region. The flange may be received in and supported by the slot and have a width that creates a distance between the circumferential edge of the wafer and the wafer boat pillar. The distance is such that the wafer boat pillars do not substantially affect a layer thickness of a layer deposited on the wafer during wafer processing.
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一种半导体衬底处理设备，包括处理室、晶片舟和多个晶片支撑件。晶片舟配置为容纳多个晶片，并且可容纳在处理室中，用于在每个晶片上沉积层。晶片舟包括至少两个晶片舟支柱，其中每个晶片舟支柱包括多个狭槽。每个晶片支撑件包括配置为支撑晶片的至少周向边缘的支撑区域，以及周向围绕支撑</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Semiconductor substrate processing apparatus |
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