Semiconductor substrate processing apparatus

A semiconductor substrate processing apparatus includes a processing chamber, a wafer boat, and a plurality of wafer supports. The wafer boat is configured to accommodate a plurality of wafers and is receivable in a processing chamber for depositing a layer on each wafer. The wafer boat includes at least two wafer boat pillars, wherein each wafer boat pillar includes a plurality of slots. Each wafer support includes a support region configured to support at least a circumferential edge of a wafer, and a flange circumferentially surrounding the support region. The flange may be received in and supported by the slot and have a width that creates a distance between the circumferential edge of the wafer and the wafer boat pillar. The distance is such that the wafer boat pillars do not substantially affect a layer thickness of a layer deposited on the wafer during wafer processing. 一种半导体衬底处理设备，包括处理室、晶片舟和多个晶片支撑件。晶片舟配置为容纳多个晶片，并且可容纳在处理室中，用于在每个晶片上沉积层。晶片舟包括至少两个晶片舟支柱，其中每个晶片舟支柱包括多个狭槽。每个晶片支撑件包括配置为支撑晶片的至少周向边缘的支撑区域，以及周向围绕支撑