LASER PROCESSING METHOD, LASER PROCESSING APPARATUS, AND METHOD FOR MANUFACTURING SOLAR CELL

Provided is a laser processing method for selectively processing a second layer (202) on a laminate (200) having a first layer (201) and the second layer (202) on the first layer (201), the laser processing method comprising: (a) a step for forming a first groove (G1) in the second layer (202) by ir...

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Bibliographische Detailangaben
Hauptverfasser:	IKEDA TAKESHI, MIYAZAKI YUHANG, SAGAWA MASAHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a laser processing method for selectively processing a second layer (202) on a laminate (200) having a first layer (201) and the second layer (202) on the first layer (201), the laser processing method comprising: (a) a step for forming a first groove (G1) in the second layer (202) by irradiating the second layer (202) with a first laser beam having a first condensing diameter; (b) forming a second groove (G2) in the second layer (202) by irradiating a second laser beam having a second condensing diameter smaller than the first condensing diameter on both sides of the center of the first groove (G1) inside the first groove (G1); and (c) forming a third groove (G3) in the second layer (202) by irradiating the inside of the second groove (G2) with a third laser beam having a third condensing diameter larger than the second condensing diameter. The present invention enables laser processing with a small taper in selective processing of a laminate. 本发明提供一种激光加工方法，对于具有第一层(201)和第一层(201)上的第二层(202)的层叠体(200