Integrated assembly and method of forming integrated assembly

Some embodiments include an integrated assembly having a first level. The first level has a first memory cell level alternating with a first insulation level. A second level is over the first level. The second level has a second memory cell level alternating with a second insulation level. A column...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	P. R. M. RAO, CHANDOLU ANILKUMAR, HUSSAIN S M I, PETERSON JOEL D, MATAMIS GEORGE, FAZIL DAMIR, DHAJALAN ASHISH KUMAR, LARSON CINNAMON, ISLAM RUSSELL, FAYRUSHIN ALBERT
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ELECTRICITY
Online-Zugang:	Volltext bestellen
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