Immersion cooling device, heat pipe and cold plate
The present invention provides an immersion cooling apparatus. The immersion cooling apparatus includes: an electrical electronic device; a fluorine-based insulating refrigerant; and a coolant tank for storing the fluorine-based insulating refrigerant, the electrical/electronic device being at least...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present invention provides an immersion cooling apparatus. The immersion cooling apparatus includes: an electrical electronic device; a fluorine-based insulating refrigerant; and a coolant tank for storing the fluorine-based insulating refrigerant, the electrical/electronic device being at least partially immersed in the fluorine-based insulating refrigerant, and the boiling point of the fluorine-based insulating refrigerant being 50-60 DEG C.
本发明提供一种浸没冷却装置,该浸没冷却装置包括:电气电子设备;氟类绝缘性制冷剂;和储存该氟类绝缘性制冷剂的冷却剂槽,该电气电子设置至少部分地浸渍在该氟类绝缘性制冷剂内,该氟类绝缘性制冷剂的沸点为50~60℃。 |
---|