Novel chip protection ring structure
The invention discloses a novel chip protection ring structure, a protection ring is arranged around the outer side of a circuit area on a chip and comprises a first protection ring section and a second protection ring section, the first protection ring section is located on the corresponding side o...
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The invention discloses a novel chip protection ring structure, a protection ring is arranged around the outer side of a circuit area on a chip and comprises a first protection ring section and a second protection ring section, the first protection ring section is located on the corresponding side of a first sub-circuit area, and the second protection ring section is located on the corresponding side of a second sub-circuit area. The first protection ring section comprises a first insulating layer, a first via hole layer and a first metal layer which are connected and located on the active region of the substrate from bottom to top, the second protection ring section comprises a second via hole layer and a second metal layer which are connected and located on the active region of the substrate from bottom to top, and the first via hole layer and the first metal layer are correspondingly connected with the second via hole layer and the second metal layer; the first insulating layer and the second via hole laye |
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