High-heat-resistance microalloy rolled copper foil as well as preparation method and application thereof

The invention discloses a high-heat-resistance microalloy rolled copper foil as well as a preparation method and application thereof. The high-heat-resistance microalloy rolled copper foil comprises a copper foil layer and a plating layer, the thickness of the copper foil layer is 18-70 [mu] m, the...

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Bibliographische Detailangaben
Hauptverfasser: WANG YACHAO, TONG QINGPING, CHEN BIN, ZHANG CHUNYANG, HAO ZHENGMING, ZHU YUE, HEI XIAOLONG, LIU JING, ZHAO TIANSHENG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a high-heat-resistance microalloy rolled copper foil as well as a preparation method and application thereof. The high-heat-resistance microalloy rolled copper foil comprises a copper foil layer and a plating layer, the thickness of the copper foil layer is 18-70 [mu] m, the total content of iron, silver, nickel, phosphorus, sulfur and tin is 1-200 ppm, the oxygen content is 80-300 ppm, and the balance is copper; and the thickness of the plating layer is 0.6-2 microns. A copper foil base material is subjected to 3-5-pass rolling, the single-pass reduction rate is 20-50%, the total in-side tension is 1-6 KN, the total out-side tension is 1-8 KN, the rolling speed is 150-500 m/min, the rolling force is 300-450 N, the roll bending force is-5-8 MPa, the rolled copper foil is sequentially subjected to electrolytic degreasing, acid pickling, copper plating, nickel plating, zinc plating and chromium plating treatment, a rolled copper foil finished product is obtained, the requirements for etc