Organosilicon UV moisture curing resin and preparation method thereof

The invention relates to organosilicon UV moisture-cured resin and a preparation method thereof, and belongs to the field of light-cured oligomers. The organosilicone UV moisture-cured resin is prepared from an HDI (hexamethylene diisocyanate) tripolymer, an antioxidant, a secondary amine silane cou...

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Hauptverfasser: LIN HENG, WANG JIEMING, CHEN KUIDA, ZOU QINGPENG, JIA GUOZHONG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to organosilicon UV moisture-cured resin and a preparation method thereof, and belongs to the field of light-cured oligomers. The organosilicone UV moisture-cured resin is prepared from an HDI (hexamethylene diisocyanate) tripolymer, an antioxidant, a secondary amine silane coupling agent, a catalyst, a polymerization inhibitor, (methyl) hydroxyl acrylate and mixed dihydric alcohol through a three-step reaction. The secondary amine silane coupling agent is used, the reaction controllability is high, the excellent three-proofing performance of organic silicon is introduced into the structure, HDI tripolymer reacts with mixed dihydric alcohol, the prepared resin has the advantages of being excellent in three-proofing performance, good in adhesive force, high in hardness and small in shrinkage, industrialization can be achieved after the technology is refined, and the application range is wide. Compared with the existing non-organic silicon resin, the non-organic silicon resin has obvious a