Gold wire bonding method and gold wire bonding system

The invention relates to a gold wire bonding method and system, and the method is used for achieving the packaging of an optical transceiver module, and comprises the following steps: S1, enabling a photoelectric chip or device to be mounted on a PCBA board through a surface mounting technology; s2, welding a grounding bonding pad, a power bonding pad and a low-frequency control signal bonding pad in the photoelectric chip or device on the PCBA board by adopting a spherical welding process; s3, the ball bonding process is detected; s4, welding a high-frequency control signal bonding pad in the photoelectric chip or device on the PCBA board by adopting a wedge-shaped welding process; s5, detecting a ball bonding process and a wedge bonding process; the system is used for realizing the gold wire bonding method and comprises a carrier and a transmission device, and a ball bonding gold wire bonding device, a first appearance detection device, a wedge bonding gold wire bonding device and a second appearance detect