Radical activated carbon film deposition
A crystalline or amorphous carbon film is deposited on a substrate using a radically activated carbon-containing precursor. The carbon-containing precursor comprises one or more C-C bonds and/or one or more C-H bonds. The radicals are generated in a remote plasma source upstream of the reaction cham...
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creator | WEIMER MATTHEW SCOTT VARADARAJAN BHADRI N |
description | A crystalline or amorphous carbon film is deposited on a substrate using a radically activated carbon-containing precursor. The carbon-containing precursor comprises one or more C-C bonds and/or one or more C-H bonds. The radicals are generated in a remote plasma source upstream of the reaction chamber, and the carbon-containing precursor flows into the reaction chamber downstream of the remote plasma source. The free radicals interact with C-C and/or C-H bonds to activate the carbonaceous precursor in an environment adjacent to the substrate. In some embodiments, a highly conformal amorphous carbon film is deposited by a precursor containing radical activated carbon.
使用含自由基活化碳的前体将结晶或非晶碳膜沉积在衬底上。含碳前体包含一或多个C-C键和/或一或多个C-H键。自由基在位于反应腔室上游的远程等离子体源中产生,且含碳前体流动到远程等离子体源下游的反应腔室中。自由基与C-C键和/或C-H键相互作用以在邻近于衬底的环境中活化含碳前体。在一些实施方案中,高度保形的非晶碳膜通过含自由基活化碳的前体沉积。 |
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使用含自由基活化碳的前体将结晶或非晶碳膜沉积在衬底上。含碳前体包含一或多个C-C键和/或一或多个C-H键。自由基在位于反应腔室上游的远程等离子体源中产生,且含碳前体流动到远程等离子体源下游的反应腔室中。自由基与C-C键和/或C-H键相互作用以在邻近于衬底的环境中活化含碳前体。在一些实施方案中,高度保形的非晶碳膜通过含自由基活化碳的前体沉积。</description><language>chi ; eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230428&DB=EPODOC&CC=CN&NR=116034183A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230428&DB=EPODOC&CC=CN&NR=116034183A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WEIMER MATTHEW SCOTT</creatorcontrib><creatorcontrib>VARADARAJAN BHADRI N</creatorcontrib><title>Radical activated carbon film deposition</title><description>A crystalline or amorphous carbon film is deposited on a substrate using a radically activated carbon-containing precursor. The carbon-containing precursor comprises one or more C-C bonds and/or one or more C-H bonds. The radicals are generated in a remote plasma source upstream of the reaction chamber, and the carbon-containing precursor flows into the reaction chamber downstream of the remote plasma source. The free radicals interact with C-C and/or C-H bonds to activate the carbonaceous precursor in an environment adjacent to the substrate. In some embodiments, a highly conformal amorphous carbon film is deposited by a precursor containing radical activated carbon.
使用含自由基活化碳的前体将结晶或非晶碳膜沉积在衬底上。含碳前体包含一或多个C-C键和/或一或多个C-H键。自由基在位于反应腔室上游的远程等离子体源中产生,且含碳前体流动到远程等离子体源下游的反应腔室中。自由基与C-C键和/或C-H键相互作用以在邻近于衬底的环境中活化含碳前体。在一些实施方案中,高度保形的非晶碳膜通过含自由基活化碳的前体沉积。</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAISkzJTE7MUUhMLsksSyxJTVFITixKys9TSMvMyVVISS3IL84syczP42FgTUvMKU7lhdLcDIpuriHOHrpAFfGpxQWJyal5qSXxzn6GhmYGxiaGFsaOxsSoAQDMFChF</recordid><startdate>20230428</startdate><enddate>20230428</enddate><creator>WEIMER MATTHEW SCOTT</creator><creator>VARADARAJAN BHADRI N</creator><scope>EVB</scope></search><sort><creationdate>20230428</creationdate><title>Radical activated carbon film deposition</title><author>WEIMER MATTHEW SCOTT ; VARADARAJAN BHADRI N</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116034183A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>WEIMER MATTHEW SCOTT</creatorcontrib><creatorcontrib>VARADARAJAN BHADRI N</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WEIMER MATTHEW SCOTT</au><au>VARADARAJAN BHADRI N</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Radical activated carbon film deposition</title><date>2023-04-28</date><risdate>2023</risdate><abstract>A crystalline or amorphous carbon film is deposited on a substrate using a radically activated carbon-containing precursor. The carbon-containing precursor comprises one or more C-C bonds and/or one or more C-H bonds. The radicals are generated in a remote plasma source upstream of the reaction chamber, and the carbon-containing precursor flows into the reaction chamber downstream of the remote plasma source. The free radicals interact with C-C and/or C-H bonds to activate the carbonaceous precursor in an environment adjacent to the substrate. In some embodiments, a highly conformal amorphous carbon film is deposited by a precursor containing radical activated carbon.
使用含自由基活化碳的前体将结晶或非晶碳膜沉积在衬底上。含碳前体包含一或多个C-C键和/或一或多个C-H键。自由基在位于反应腔室上游的远程等离子体源中产生,且含碳前体流动到远程等离子体源下游的反应腔室中。自由基与C-C键和/或C-H键相互作用以在邻近于衬底的环境中活化含碳前体。在一些实施方案中,高度保形的非晶碳膜通过含自由基活化碳的前体沉积。</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | Radical activated carbon film deposition |
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