Method for slowing down aging of copper and copper alloy ultra-fine wires

The invention discloses a method for slowing down aging of a copper and copper alloy ultra-fine wire, aims at slowing down performance reduction of the ultra-fine wire in storage and use processes, and belongs to the technical field of copper and copper alloy ultra-fine wire processing. The method m...

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1. Verfasser: CHENG TIANCI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a method for slowing down aging of a copper and copper alloy ultra-fine wire, aims at slowing down performance reduction of the ultra-fine wire in storage and use processes, and belongs to the technical field of copper and copper alloy ultra-fine wire processing. The method mainly aims at copper and copper alloy ultra-fine wires with the wire diameter smaller than or equal to 0.05 mm, the technical effect of relieving aging of the copper alloy ultra-fine wires is achieved under the condition that a small amount of tensile strength is lost by measuring the grain size G and the wire diameter D of the ultra-fine wires, introducing a dimensionless numerical value D/G and selecting specific low-temperature heat treatment parameters according to the D/G value; the storage and use time of the material is prolonged. 本发明公开一种减缓铜及铜合金极细线老化的方法,旨在减缓极细线在存储和使用过程中性能下降的情况,属于铜及铜合金极细线加工技术领域。该方法主要针对铜及铜合金线径小于等于0.05mm极细线,通过测定极细线的晶粒尺寸G与线径D,引入无量纲数值D/G,根据D/G值选择特定的低温热处理参数,在损失少量的抗拉强度条件下,达到了减缓铜合金极细线的老化的技术效果,提高材料的存