Laser electrochemical machining method for machining copper microstructure

According to the laser electrochemical machining method for the copper microstructure, compared with LIGA technology electroplating additive machining, the defect that an electroplating material is loose in texture is overcome, the machining period is shorter than LIGA electroplating machining, and...

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Bibliographische Detailangaben
Hauptverfasser: SHEN CHENGWEI, YAN YING, ZHOU PING, DONG JINTONG
Format: Patent
Sprache:chi ; eng
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