Laser electrochemical machining method for machining copper microstructure

According to the laser electrochemical machining method for the copper microstructure, compared with LIGA technology electroplating additive machining, the defect that an electroplating material is loose in texture is overcome, the machining period is shorter than LIGA electroplating machining, and...

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Bibliographische Detailangaben
Hauptverfasser: SHEN CHENGWEI, YAN YING, ZHOU PING, DONG JINTONG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:According to the laser electrochemical machining method for the copper microstructure, compared with LIGA technology electroplating additive machining, the defect that an electroplating material is loose in texture is overcome, the machining period is shorter than LIGA electroplating machining, and the mechanical property of a machined workpiece is good. Laser electrochemical combined machining is adopted and belongs to stress-free machining, a high-precision three-axis moving platform is used, a laser electrochemical machining device serves as a special'cutter ', and high-precision and high-surface-quality copper microstructure machining is achieved through platform movement, laser power, electrolyte flow velocity and machining voltage coupling. The advantages of high milling efficiency and high precision are reserved, metal plastic flow caused by milling is avoided, and the edge of the notch is free of burrs and protrusions. The laser beam is introduced to the machining area from the position above the cath