Device for cooling power module and power module

The invention relates to a device for cooling a power module having at least one power unit (LE) in a housing, having at least one heat sink (NKK), the device for cooling having at least one heat sink cover (NKKA), at least one part of the power module, in particular the housing, at least one part of the heat sink (NKK) and/or at least one part of the heat sink cover (NKKA) is configured such that the heat sink (NKK) interacts with the heat sink (NKK), the heat sink cover (NKKA) and/or the housing after the heat sink cover (NKKA) is placed, in particular by means of locking, is secured in the housing. The invention further relates to a power module having such a device for cooling a power module. 本发明涉及一种用于冷却功率模块的装置，所述功率模块具有壳体中的至少一个功率单元(LE)，所述装置具有至少一个散热器(NKK)，其中用于冷却的装置具有至少一个散热器盖(NKKA)，并且所述功率模块的至少一部分、尤其是所述壳体、所述散热器(NKK)的至少一部分和/或所述散热器盖(NKKA)的至少一部分被配置为使得所述散热器(NKK)在安置所述散热器盖(NKKA)之后通过散热器(NKK)、散热器盖(NKKA)和/或壳体的配置共同起作用、尤其是通过锁紧而被固定在所述壳体中。本发明此外涉及具有用于冷却功率模块的这种装置的功率模块。