COPPER FOIL, LAMINATE, AND METHOD FOR MANUFACTURING SAME

The purpose of the present invention is to provide a copper foil with which it is possible to obtain a wiring board having high-frequency characteristics and also having high peel strength when a wiring board is produced using a resin base material containing LCP. The copper foil has irregularities...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OBATA NAOKI, SATO MAKIKO, KOKAJI KAISUKE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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