COPPER FOIL, LAMINATE, AND METHOD FOR MANUFACTURING SAME

The purpose of the present invention is to provide a copper foil with which it is possible to obtain a wiring board having high-frequency characteristics and also having high peel strength when a wiring board is produced using a resin base material containing LCP. The copper foil has irregularities on part or all of the surface thereof, the irregularities having an Ra of 0.01 [mu] m to 0.10 [mu] m and an RSm of 1.20 [mu] m to 4.00 [mu] m, or an Rz of 0.1 [mu] m to 0.90 [mu] m and an RSm of 1.20 [mu] m to 4.00 [mu] m, or an Ra of 0.034 [mu] m to 0.092 [mu] m, and an Rz of 0.25 [mu] m to 0.87 [mu] m and an RSm of 1.21 [mu] m to 3.57 [mu] m. 本发明的目的在于提供一种铜箔，该铜箔在使用包含LCP的树脂基材制作配线板时，能够得到具有高频特性并且能够兼顾高剥离强度的配线板。该铜箔在部分或全部表面具有凹凸，上述凹凸的Ra为0.01μm以上0.10μm以下且RSm为1.20μm以上4.00μm以下，或Rz为0.1μm以上0.90μm以下且RSm为1.20μm以上4.00μm以下，或者Ra为0.034μm以上0.092μm以下、Rz为0.25μm以上0.87μm以下且RSm为1.21μm以上3.57μm以下。