Semiconductor laser and manufacturing method thereof
The invention relates to the technical field of semiconductor lasers, and provides a manufacturing method of a semiconductor laser, which comprises the following steps: S1, preparing an epitaxial structure which comprises a P-type DBR (Distributed Bragg Reflector) with a highly-doped layer, S2, etch...
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creator | YANG XU DAI LU GUO DINGKAI |
description | The invention relates to the technical field of semiconductor lasers, and provides a manufacturing method of a semiconductor laser, which comprises the following steps: S1, preparing an epitaxial structure which comprises a P-type DBR (Distributed Bragg Reflector) with a highly-doped layer, S2, etching the annular P-type DBR on the surface of the epitaxial structure until the highly-doped layer is etched, S3, manufacturing a P-type contact electrode on the highly-doped layer, and S4, manufacturing a P-type contact electrode on the highly-doped layer. The method comprises the following steps: S1, preparing a P-type contact electrode, and processing the P-type contact electrode, S4, preparing an N-type electrode, and processing the N-type contact electrode, and S5, cutting the chip. The invention further provides a semiconductor laser, the semiconductor laser comprises the N-type DBR, the active region, the oxide layer and the P-type DBR which are sequentially grown on the substrate, the P-type DBR is etched to |
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The method comprises the following steps: S1, preparing a P-type contact electrode, and processing the P-type contact electrode, S4, preparing an N-type electrode, and processing the N-type contact electrode, and S5, cutting the chip. 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The method comprises the following steps: S1, preparing a P-type contact electrode, and processing the P-type contact electrode, S4, preparing an N-type electrode, and processing the N-type contact electrode, and S5, cutting the chip. 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The method comprises the following steps: S1, preparing a P-type contact electrode, and processing the P-type contact electrode, S4, preparing an N-type electrode, and processing the N-type contact electrode, and S5, cutting the chip. The invention further provides a semiconductor laser, the semiconductor laser comprises the N-type DBR, the active region, the oxide layer and the P-type DBR which are sequentially grown on the substrate, the P-type DBR is etched to</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRICITY |
title | Semiconductor laser and manufacturing method thereof |
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