Electronic device and manufacturing method thereof

The invention provides a manufacturing method of an electronic device. The manufacturing method comprises the following steps: providing a substrate; forming a thin film transistor layer on the substrate; forming a first passivation layer on the substrate; forming an organic layer on the substrate; patterning the organic layer to expose the first region; forming a second passivation layer on the substrate; patterning the first passivation layer to expose the second region; forming a bonding pad on the substrate and corresponding to an overlapping region of the first region and the second region; and bonding the electronic component on the bonding pad. The invention also provides an electronic device. 本公开提供一种电子装置的制造方法，包含以下步骤：提供基板；形成薄膜晶体管层于基板上；形成第一钝化层于基板上；形成有机层于基板上；图案化有机层以暴露出第一区域；形成第二钝化层于基板上；图案化第一钝化层以暴露出第二区域；形成接合垫于基板上且对应于第一区域以及第二区域的重叠区域；以及将电子组件接合于接合垫上。本公开亦提供一种电子装置。