Manufacturing and measuring method of semiconductor structure

The invention provides a method for manufacturing and measuring a plurality of semiconductor structures. The method comprises the following steps of: receiving a wafer, wherein the wafer is provided with a plurality of crystal grains; the plurality of semiconductor structures are respectively formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHENG ZHENGDA, HUANG ZUWEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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