Glue cleaning method for back surface of roughly polished germanium wafer

The invention relates to a rough polishing germanium wafer back adhesive cleaning process, and belongs to the technical field of semiconductor materials, the rough polishing germanium wafer back adhesive cleaning process specifically comprises the steps that after a degumming solution is used for cleaning, concentrated sulfuric acid with different concentrations is used for cleaning, and the degumming solution comprises, by volume percentage concentration, 50-90% of amino trimethylene phosphoric acid, 1-10% of perchloric acid, 1-5% of EDTA-2Na and the balance pure water. According to the method, the degumming liquid is firstly adopted for cleaning, and then the concentrated sulfuric acid is adopted for carbonization cleaning, so that the method has the characteristics of thorough removal of viscose on the back surface of the wafer, simple operation, high production efficiency and capability of reducing corrosion of acid liquor to the surface of the rough polishing germanium wafer, and batch, efficient and sta