SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS

The present technology relates to a semiconductor device including an underfill resin and a light-shielding resin and achieving a reduction in device size, a method of producing the same, and an electronic apparatus. The semiconductor device includes: a substrate having a pixel region in which a plurality of pixels are arranged; and one or more chips flip-chip bonded to the substrate via connection terminals connected therebetween. The first resin protects the chip rear surface, and the second resin protects the chip side surface, the first resin and the second resin including different materials. The present technology can be applied, for example, to a semiconductor device in which an image sensor chip and a signal processing chip are flip-chip bonded to each other. 本技术涉及包括底部填充树脂和遮光树脂并且实现了器件尺寸的减小的半导体器件、生产该半导体器件的方法、以及电子设备。该半导体器件包括：基板，具有布置有多个像素的像素区域；以及一个或多个芯片，经由连接在其间的连接端子倒装接合到基板。第一树脂保护芯片后表面，并且第二树脂保护芯片侧表面，该第一树脂和第二树脂包括不同的材料。例如，本技术可应用于其中图像传感器芯片和信号处理芯片彼此倒装结合在一起的半导体器件。