SOLDER COMPOSITION AND ELECTRONIC COMPONENT

The invention provides a solder composition containing Sn. The composition contains 1.0 to 5.0% by mass of Cu, 0.1 to 0.5% by mass of Ni, and more than 0.01% by mass but not more than 0.5% by mass of Ge. 本发明提供一种含有Sn的焊料组合物。该组合物含有1.0～5.0质量％的Cu、0.1～0.5质量％的Ni、以及多于0.01质量％且0.5质量％以下的Ge。...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KITAJIMA NOBUO, ONO MAKOTO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CURRENT COLLECTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRICITY LINE CONNECTORS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention provides a solder composition containing Sn. The composition contains 1.0 to 5.0% by mass of Cu, 0.1 to 0.5% by mass of Ni, and more than 0.01% by mass but not more than 0.5% by mass of Ge. 本发明提供一种含有Sn的焊料组合物。该组合物含有1.0～5.0质量％的Cu、0.1～0.5质量％的Ni、以及多于0.01质量％且0.5质量％以下的Ge。