Electronic equipment, ultrasonic transducer, semiconductor chip of ultrasonic transducer and preparation method of semiconductor chip

The invention belongs to the technical field of fingerprint identification, and particularly relates to electronic equipment, an ultrasonic transducer, a semiconductor chip of the ultrasonic transducer and a preparation method of the semiconductor chip. The invention aims to solve the problem that a chip circuit of an existing ultrasonic transducer is easy to break down in the polarization process of a piezoelectric material layer. A semiconductor substrate of the semiconductor chip is configured to be grounded in a polarization process of an ultrasonic transducer; a first circuit structure and a first electric connection part are formed on the semiconductor substrate, the first electric connection part is electrically connected with the semiconductor substrate to realize grounding, the first circuit structure is insulated from the semiconductor substrate, and the conductive connection layer is electrically connected with the first electric connection part and the first circuit structure. The first circuit st