SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Provided are a substrate processing apparatus and a substrate processing method. The apparatus includes: a processing container having a processing space; a support unit that supports the substrate in the processing space and rotates the substrate; a liquid supply unit that supplies a processing liquid to the substrate supported by the support unit; and a heating unit that heats the substrate. The support unit includes: a driver that rotates the spin chuck; a chuck pin mounted on the spin chuck to rotate therewith; and a chuck pin moving unit that moves the chuck pin between a contact position where the chuck pin is in contact with the side portion of the substrate and an open position where the chuck pin is spaced apart from the side portion of the substrate. The chuck pin moving unit includes a first driving module coupled to and rotating with the chuck pin and a second driving module facing the first driving module and not rotating with the spin chuck, the first driving module including a first magnetic bo