Packaging substrate for stacking, stacked packaging substrate, chip packaging structure of stacked packaging substrate, and preparation method of stacked packaging substrate

The invention discloses a stacked package substrate, which comprises a first package substrate and a second package substrate which are conductively jointed with each other, and is characterized in that the first package substrate comprises a first wiring layer, a first joint dielectric layer located on the lower surface of the first wiring layer and a first joint conductive column surrounded by the first joint dielectric layer; the second packaging substrate comprises a second wiring layer, a second joint dielectric layer located on the upper surface of the second wiring layer and a second joint conductive column surrounded by the second joint dielectric layer; the first joint conductive columns and the second joint conductive columns correspondingly form conductive joint; the first bonding dielectric layer and the second bonding dielectric layer are physically bonded to form a bonding dielectric layer. The invention further discloses a packaging substrate for stacking, a chip packaging structure of the stac