Organosilicon polymer/benzoxazine/epoxy resin packaging adhesive and preparation method thereof

The invention discloses an organosilicon polymer/benzoxazine/epoxy resin packaging adhesive and a preparation method thereof. The packaging adhesive is prepared from the following raw materials, a platinum catalyst and an inhibitor: organic silicon modified benzoxazine SMB2, organic silicon modified...

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Bibliographische Detailangaben
Hauptverfasser: MIAO MINGSONG, HUANG HENGCHAO, JIANG JINBO, FU ZI'EN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses an organosilicon polymer/benzoxazine/epoxy resin packaging adhesive and a preparation method thereof. The packaging adhesive is prepared from the following raw materials, a platinum catalyst and an inhibitor: organic silicon modified benzoxazine SMB2, organic silicon modified epoxy resin SME2, an organic silicon polymer and a powder filler, the organic silicon modified benzoxazine resin SMB2 is a mixture prepared by carrying out hydrosilylation reaction on a BZ compound, divinyl tetramethyl disiloxane and double-end hydrogen-containing silicone oil under the catalysis of a platinum catalyst; the organic silicon modified epoxy resin SME2 is a mixture prepared by carrying out hydrosilylation reaction on allyl alcohol glycidyl ether and double-end hydrogen-containing silicone oil under the catalysis of a platinum catalyst; and the organic silicon polymer is hydrogen-terminated polydimethylsiloxane and vinyl-terminated polydimethylsiloxane. The packaging adhesive is low in gas permeability