Grinding disc for grinding gallium nitride wafer

The invention discloses a grinding disc for grinding gallium nitride wafers. The grinding disc comprises a disc body, and the working surface of the disc body is provided with 2-3 concentric spiral grooves in the same direction, and the spiral grooves are digt. Di is the depth of the ith spiral groove from outside to inside, di + 1 is the depth of the (i + 1) th spiral groove from outside to inside, and i is a positive integer. Compared with the prior art, the grinding efficiency of the grinding disc on the gallium nitride wafer can be improved to 32-40 [mu] m/h from existing 20-30 [mu] m/h, the overall yield is improved to 98% or above from about 95%, the roughness Ra (50 * 50 [mu] m) is reduced to about 240 nm from about 280 nm, and meanwhile the use amount of the diamond liquid is reduced. 本发明公开了一种用于氮化镓晶片研磨加工的研磨盘。该研磨盘包括盘体，盘体的工作表面具有2～3条同心同向的螺旋槽，且di>di+1，其中，di为由外向内数的第i条螺旋槽的槽深，di+1为由外向内数的第i+1条螺旋槽的槽深，i为正整数。与现有技术相比，采用本发明的研磨盘对氮化镓晶片的研磨效率可由现有的20-30μm/h提升至32-40μm/h，整体良率由95％左右提升至98％以上，粗糙度Ra(50*50um)由280nm左右降至240nm左右