Test structure and test array
According to the test structure and the test array provided by the invention, on one hand, the first tested device and the second tested device can be arranged in the bonding pad array through staggered arrangement of the first tested device and the second tested device, and the bonding pads for con...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | According to the test structure and the test array provided by the invention, on one hand, the first tested device and the second tested device can be arranged in the bonding pad array through staggered arrangement of the first tested device and the second tested device, and the bonding pads for connecting the first tested device and the second tested device are crossed and staggered, so that typesetting is more compact; the layout area is greatly saved, and the layout area utilization rate is improved; on the other hand, the auxiliary bonding pads aligned with the main bonding pads are additionally arranged on the main bonding pads in the direction perpendicular to the straight line where the auxiliary bonding pads are arranged, so that the size of the bonding pads is increased in the direction perpendicular to the straight line where the auxiliary bonding pads are arranged, the size in the direction of the straight line is not increased, and then the requirement of Kelvin four-line testing can be met; and t |
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