Heat sink material, preparation method thereof and electronic packaging material

The invention discloses a heat sink material and a preparation method thereof and an electronic packaging material, and the preparation method comprises the following steps: sequentially laminating a lower high-thermal-conductivity material layer, a lower low-expansion-coefficient material layer, a...

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Bibliographische Detailangaben
1. Verfasser:	LIU WEIHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METALLURGY PERFORMING OPERATIONS PUNCHING METAL ROLLING OF METAL SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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