Heat sink material, preparation method thereof and electronic packaging material

The invention discloses a heat sink material and a preparation method thereof and an electronic packaging material, and the preparation method comprises the following steps: sequentially laminating a lower high-thermal-conductivity material layer, a lower low-expansion-coefficient material layer, a middle material layer, an upper low-expansion-coefficient material layer and an upper high-thermal-conductivity material layer, and preparing a prefabricated heat sink material; pressurizing the lower high-thermal-conductivity material layer and the upper high-thermal-conductivity material layer, heating the prefabricated heat sink material, and rolling to prepare the heat sink material of the lower high-thermal-conductivity layer, the lower low-expansion-coefficient layer, the middle layer, the upper low-expansion-coefficient layer and the upper high-thermal-conductivity layer which are stacked in sequence. The heat sink material with high thermal conductivity and low expansion coefficient is efficiently obtained