Heat sink material, preparation method thereof and electronic packaging material
The invention discloses a heat sink material and a preparation method thereof and an electronic packaging material, and the preparation method comprises the following steps: sequentially laminating a lower high-thermal-conductivity material layer, a lower low-expansion-coefficient material layer, a...
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| creator | LIU WEIHENG |
| description | The invention discloses a heat sink material and a preparation method thereof and an electronic packaging material, and the preparation method comprises the following steps: sequentially laminating a lower high-thermal-conductivity material layer, a lower low-expansion-coefficient material layer, a middle material layer, an upper low-expansion-coefficient material layer and an upper high-thermal-conductivity material layer, and preparing a prefabricated heat sink material; pressurizing the lower high-thermal-conductivity material layer and the upper high-thermal-conductivity material layer, heating the prefabricated heat sink material, and rolling to prepare the heat sink material of the lower high-thermal-conductivity layer, the lower low-expansion-coefficient layer, the middle layer, the upper low-expansion-coefficient layer and the upper high-thermal-conductivity layer which are stacked in sequence. The heat sink material with high thermal conductivity and low expansion coefficient is efficiently obtained |
| format | Patent |
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The heat sink material with high thermal conductivity and low expansion coefficient is efficiently obtained</description><language>chi ; eng</language><subject>ALLOYS ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL ; METALLURGY ; PERFORMING OPERATIONS ; PUNCHING METAL ; ROLLING OF METAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230407&DB=EPODOC&CC=CN&NR=115923305A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230407&DB=EPODOC&CC=CN&NR=115923305A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU WEIHENG</creatorcontrib><title>Heat sink material, preparation method thereof and electronic packaging material</title><description>The invention discloses a heat sink material and a preparation method thereof and an electronic packaging material, and the preparation method comprises the following steps: sequentially laminating a lower high-thermal-conductivity material layer, a lower low-expansion-coefficient material layer, a middle material layer, an upper low-expansion-coefficient material layer and an upper high-thermal-conductivity material layer, and preparing a prefabricated heat sink material; pressurizing the lower high-thermal-conductivity material layer and the upper high-thermal-conductivity material layer, heating the prefabricated heat sink material, and rolling to prepare the heat sink material of the lower high-thermal-conductivity layer, the lower low-expansion-coefficient layer, the middle layer, the upper low-expansion-coefficient layer and the upper high-thermal-conductivity layer which are stacked in sequence. 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The heat sink material with high thermal conductivity and low expansion coefficient is efficiently obtained</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METALLURGY PERFORMING OPERATIONS PUNCHING METAL ROLLING OF METAL SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS |
| title | Heat sink material, preparation method thereof and electronic packaging material |
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