Forming process of large-thickness and variable-surface beam type wave-absorbing structural member
The invention relates to a forming process of a large-thickness and variable-surface beam type wave-absorbing structural member. The forming process comprises the following steps: S1, preparing a medium-temperature epoxy wave-absorbing prepreg; s2, the number of layers of the needed prepreg is calcu...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a forming process of a large-thickness and variable-surface beam type wave-absorbing structural member. The forming process comprises the following steps: S1, preparing a medium-temperature epoxy wave-absorbing prepreg; s2, the number of layers of the needed prepreg is calculated according to the thickness requirement of the wave-absorbing structural part, and then the prepreg is cut into multiple layers according to the shape of a cavity of the special forming tool; s3, performing hot pressing on a certain number of layers of prepreg by combining a special forming tool; s4, the step S3 is repeated until hot pressing of all the prepregs is completed, and then the prepregs are cured into the wave-absorbing structural part by combining a special forming tool; and S5, after the wave-absorbing structural part is demolded, shape machining is conducted on the wave-absorbing structural part. The method has the advantages that the medium-temperature epoxy wave-absorbing prepreg is adopted to |
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