Electronic circuit

The invention relates to an electronic circuit (1) comprising a plurality of printed circuits (2) connected by at least one bus bar (4), each printed circuit (2) comprising at least two superimposed layers surrounding at least a portion of the at least one bus bar (4) to cover the at least one bus b...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BERTRAND. DUFAUDE, OLIVIER. BENOUIL, LAGONNEAU MARC, VINCENT JACQUES, ROLLIN PASCAL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention relates to an electronic circuit (1) comprising a plurality of printed circuits (2) connected by at least one bus bar (4), each printed circuit (2) comprising at least two superimposed layers surrounding at least a portion of the at least one bus bar (4) to cover the at least one bus bar (4). 本发明涉及一种电子电路(1)，包括由至少一个母线(4)连接的多个印刷电路(2)，每个印刷电路(2)包括至少两个叠加层，至少两个叠加层包围所述至少一个母线(4)的至少一部分，以覆盖所述至少一个母线(4)。