SEMICONDUCTOR DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME

The present invention is provided with: a device (20) provided on the surface of an organic substrate (10); a heat dissipation block (40) bonded and fixed to the surface of the device (20); and a molded resin (50) that seals the device (20) so that at least one surface of the heat dissipation block (40) is exposed, the heat dissipation block (40) includes a first portion (40a) and a second portion (40b), the hardness of the heat dissipation block (40) is gradient from the first portion (40a) on the side where the molded resin (50) is exposed to the second portion (40b) on the side where the heat dissipation block (40) is bonded to the device (20), and the hardness of the heat dissipation block (40) is different from the hardness of the first portion (40a). The material of the first part (40a) is harder than that of the second part (40b), and good grinding performance of the grinding wheel is maintained. 具备：器件(20)，其设置在有机基板(10)的表面；散热块(40)，其被粘合、固定于器件(20)的表面；以及模制树脂(50)，其以使散热块(40)的至少一面露出的方式密封器件(20)，散热块(40)包含第一部分(4