Metal buffer pad for circuit board manufacturing process

The invention relates to a metal cushion pad for a circuit board manufacturing process, which is a pad body and can be arranged between a press-fit cover plate and a separation steel plate or between a press-fit bottom plate and the separation steel plate in the circuit board manufacturing process, the pad body is provided with a plurality of metal filaments, and each metal filament is woven into a sheet body shape with a certain thickness. Furthermore, metal foils can be arranged on the two side faces of the metal cushion body respectively, so that the metal filaments can resist high temperature, cannot be degraded and cannot be broken easily, the surface of a product cannot be concaved well, vacuum leakproofness cannot be generated between the metal filaments and the separating steel plates which are attached to the metal filaments, and the service life of the product is prolonged. The practical effects of easy separation, high production efficiency and the like are realized. 本发明为用于电路板制程的金属缓冲垫，其中该金属缓冲垫为一垫体，