Semiconductor device and forming method thereof

The semiconductor device includes a first semiconductor die. The semiconductor device includes a redistribution structure disposed over a first side of a first semiconductor die and including a plurality of layers. At least a first of the plurality of layers includes a first power/ground plane embed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XU HONGREN, CHEN SHUOMAO, ZHANG FENGYUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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