Electric field control for bond pads in semiconductor device packages

Embodiments of the invention relate to electric field control for bond pads in semiconductor device packages. In described examples, an apparatus includes a semiconductor die (Fig. 6BB, 622) having a bond pad (608) on a device side surface, the semiconductor die having a ground plane (602) spaced apart from the bond pad (608) by a spacing distance (610). The bonding pad has an upper surface for receiving a spherical bond and an outer boundary, the bonding pad having a vertical side extending from the upper surface to a bottom surface formed over the device side surface of the semiconductor die. A protective overcoat PO (631) is formed overlying the ground plane and overlying the vertical side of the bond pad, and overlying a portion of the upper surface of the bond pad, and having an opening exposing a remainder of the upper surface of the bond pad, the protective overcoat having a dielectric constant of less than 3.8. 本申请案的实施例涉及用于半导体装置封装中的接合垫的电场控制。在所描述实例中，一种设备包含：半导体裸片(图6BB，622)，其在装置侧表面上具有接合垫(608)，所述半导体裸片具有与所