Semiconductor processing device, semiconductor exposure equipment and wafer exposure method
The invention provides a semiconductor processing device, semiconductor exposure equipment and a wafer exposure method.The semiconductor processing device comprises a bearing part and an adsorption chuck, the adsorption chuck penetrates through the bearing part, and the adsorption chuck adsorbs the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a semiconductor processing device, semiconductor exposure equipment and a wafer exposure method.The semiconductor processing device comprises a bearing part and an adsorption chuck, the adsorption chuck penetrates through the bearing part, and the adsorption chuck adsorbs the center area of a wafer to fix the wafer; the bearing part comprises a plurality of adjusting modules, the adjusting modules are arranged around the adsorption chuck, each adjusting module is provided with a plurality of gas channels, and the adjusting modules adjust the temperature and/or the shape of the wafer through the gas channels. According to the invention, the plurality of adjusting modules are arranged on the bearing part, the plurality of adjusting modules are arranged around the adsorption chuck, and the plurality of adjusting modules can provide the gas or extract the gas between the bearing part and the wafer, so that the wafer can be in an expected temperature and shape, thereby improving the pattern |
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