Method of forming package structure

The package structure includes a first dielectric layer, a first semiconductor device, a first redistribution line, a second dielectric layer, a second semiconductor device, a second redistribution line, a first conductive member, and a first molding material. A first semiconductor device is over the first dielectric layer. The first redistribution line is in the first dielectric layer and is electrically connected to the first semiconductor device. A second dielectric layer is over the first semiconductor device. A second semiconductor device is over the second dielectric layer. The second redistribution line is in the second dielectric layer and is electrically connected to the second semiconductor device. The first conductive member electrically connects the first redistribution line and the second redistribution line. The first molding material molds the first semiconductor device and the first conductive member. 封装结构包括第一介电层、第一半导体装置、第一重分布线、第二介电层、第二半导体装置、第二重分布线、第一导电件及第一模制材料。第一半导体装置在第一介电层上方。第一重分布线在第一介电层中且电连