400G optical module packaging structure and packaging method thereof

The invention provides a 400G optical module packaging structure and a packaging method thereof, and the structure comprises a heat dissipation part which is provided with a multi-branch silicon optical chip and a laser, the laser is used for emitting laser beams, the two ends of the multi-branch silicon optical chip are provided with beam splitters of antireflection films, and the beam splitters of the antireflection films are connected with the heat dissipation part. One end of the multi-shunt silicon optical chip is coupled with the laser so as to equally divide a laser beam into multiple laser paths; therefore, the reliability of the packaging process of the 400G optical module is improved, the packaging cost is reduced, and the stability and the product yield of the packaging structure are improved at the same time. 本发明提供一种400G光模块封装结构及其封装方法，包括：散热件，所述散热件上设有多分路硅光芯片和激光器，所述激光器用于发出激光光束，所述多分路硅光芯片两端设有增透膜的分束器，所述多分路硅光芯片一端与所述激光器耦合以能够实现将一束激光光束均分为多路激光光路；这样提高了400G光模块封装工艺可靠性，不仅降低了封装的成本费用，更同时提高了封装结构的稳定性和产品良率。