Semiconductor device and sealing door mechanism thereof

The embodiment of the invention provides semiconductor equipment and a sealing door mechanism thereof. The sealing door mechanism is used for sealing an opening of a semiconductor equipment process chamber and comprises a supporting arm and a sealing disc assembly. The sealing disc assembly comprise...

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Bibliographische Detailangaben
1. Verfasser: YAN SHIQUAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The embodiment of the invention provides semiconductor equipment and a sealing door mechanism thereof. The sealing door mechanism is used for sealing an opening of a semiconductor equipment process chamber and comprises a supporting arm and a sealing disc assembly. The sealing disc assembly comprises a sealing disc and a sealing piece, the sealing piece is arranged on the sealing disc, the sealing disc is fixedly arranged on the supporting arm, and the supporting arm is used for sealing the opening of the process chamber by pressing the sealing disc and the sealing piece; a containing cavity is formed in the sealing piece, fluid is introduced into the containing cavity so that the sealing piece can deform, and when the opening of the process cavity is closed, the gap between the sealing disc and the process cavity can be filled with the deformed sealing piece. According to the embodiment of the invention, the assembly difficulty is greatly reduced, so that the disassembly, assembly and maintenance efficiency